Digital IC back-end design engineer (Working location: Shenzhen)

Job Responsibilities:
1. Responsible for the back-end design of digital IC, and the physical realization of the chip from the netlist to GDSII, including DFT, FloorPlan, Placement, CTS, Routing, Power analysis, SI analysis, STA, Physical verify, XRC, etc.
2. Responsible for the layout and wiring of the digital IC, and assist the front end to make modifications according to the actual situation of the back end.
3. Responsible for the establishment of the design environment, chip layout, power supply planning, GDS output and physical verification, DFM analysis, and parasitic parameter extraction.
job requirements:
1. Bachelor degree or above in microelectronics, electronic engineering, integrated circuit and other related majors;
2. More than two years of experience in chip design and at least two successful mass production of large-scale digital IC chips;
3. Proficiency in the use of EDA tools for APR and DFT and design verification, proficient in the use of ing languages Perl and TCL;
4. Understand the basic principles of digital communication system and digital signal processing, ded ARM processor memory, digital bus and various standard interfaces
5. Familiar with low-power design, logic synthesis, static timing analysis and ASIC design flow.